Electronics Forum: hope (Page 200 of 341)

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef

Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati

Cleaner device for PCB

Electronics Forum | Wed Feb 04 13:12:35 EST 2004 | Debbie

Hi Rick, Cleaning No Cleans is becoming more of a norm. It is true that changing to a OA flux/paste would be a easier process to control from a cleaning standpoint. A water soluble process will cost a great deal less as well. However, if your pro

Aqueous Technologies SMT800-LD Software Question

Electronics Forum | Sat Feb 07 18:02:20 EST 2004 | Mike Konrad

Hi Steve, The Windows 98 version of the SMT800-LD software provides for two levels of password protection. One for general use (creating, editing, deleting programs), and the other for maintenance functions (individual device control, machine confi

Must read: The Manufacturing Coalition

Electronics Forum | Wed Feb 11 20:59:05 EST 2004 | vinhmach1

Hi, We are all getting the similar thought. I heard other story like the oversea gorverment (China, Brazil, Vietnam...) are taxing $$$$$ for incoming finish products up to the sky per Items. From Automotives to Electronics and others. That forcing

QFP Removal

Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40

Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The

Freshman in SMT industry needing advice

Electronics Forum | Thu Mar 04 12:34:48 EST 2004 | cyber_wolf

I know that many smaller companies clean their stencils the same way you do. If you get good results cleaning your stencils this way then I would say stick with the alcohol/wipe method. Take your stencil and put it under a microscope.If the aperture

Multitronics 2000 SX

Electronics Forum | Fri Mar 19 10:08:49 EST 2004 | davef

We don't know dip about your Multitronics 2000 SX, but there may be another angle to take in addition to the Tyco tact that Pete C proposed. The facts may not be precise [someone will hopefully straighten things out], but close enough for your needs

PCB post reflow cleaning

Electronics Forum | Sun Mar 28 22:17:36 EST 2004 | Grant Petty

Hi, I would also be interested in this thread, but our problem has a different twist to it. We have good results from our reflow with Koki no clean paste, however when we pass the boards through the wave solder machine, the flux in that leaves a fog

No-clean reflow profile

Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell

183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so

Attrition Rates

Electronics Forum | Thu Apr 08 03:41:19 EDT 2004 | Ian White

I have worken in production lines where attrition rates were measured and acceptable limits were set using 3 classes of parts:- A=Expensive Parts IC's etc, B= medium cost parts Diodes, tants etc, C= low cost parts typically Chop Caps and R's. We set


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