Electronics Forum: assemble (Page 202 of 598)

Sn/Pb diffusion

Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring

Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th

Assembleon CSM/GEM Feeders - Any tips or tricks for repair

Electronics Forum | Mon May 06 14:55:55 EDT 2002 | jdill

Hello Do any of you out there with Philips/Assembleon machines have any tips or tricks to repairing there feeders. I call Assembleon and one guy tells me to clean the heads and the feeders with a small lint free brush and to not use any oil on the he

pcb plating

Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef

Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because

Is Anyone?

Electronics Forum | Mon Jul 15 00:21:46 EDT 2002 | tjyard

Frustrated? Where do I start. Our company just lost a contract assembly job we have been providing to Altera Corp for five years. They sent it overseas to China. We had to lay everyone off at our assembly facility. Yeah, you better learn to spea

SMT COMPONENTS

Electronics Forum | Tue Jul 16 07:33:32 EDT 2002 | pjc

Communication is the issue. What we have here is a failure to communicate....how does that song go? I implemented a system whereby incoming inspection would check component packaging to the spec. If it did not match they were to contact the process e

ENIG poor wetting

Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef

Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e

bga warp

Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske

Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located

pc board defects

Electronics Forum | Sun Sep 15 08:35:42 EDT 2002 | davef

That 60+% print defects number has been bantied around for so long in the electronic assembly business for so long that people believe that it's true. One starting point for this myth and lore is: "Where Quality Is Lost On SMT Boards" C Mangin, 'Cir

Handling PCB assy's

Electronics Forum | Fri Nov 01 14:27:27 EST 2002 | kenBliss

Based on this thread Shouldn�t the handling systems allow the worker to do what is needed on the board during the stated hand operation so the worker has minimal direct contact with it. Now for the non sales pitch, sales pitch. Doesn�t it make the

Walkmen In Assembly Area

Electronics Forum | Fri Dec 13 10:21:28 EST 2002 | gregp

You asked for opinions, here's mine. If you feel you need to wear a walkman to get thru the day then you can go wear it in the unemployment line. Anyone who says they are more productive when wearing a walkman and listening to music in a dynamic wor


assemble searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
See Your 2024 IPC Certification Training Schedule for Eptac

High Throughput Reflow Oven
Best SMT Reflow Oven

Stencil Printing 101 Training Course