Electronics Forum | Tue May 07 10:13:06 EDT 2019 | cyber_wolf
I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.
Electronics Forum | Mon May 27 04:36:08 EDT 2019 | SMTA-Rogers
Dear Sr.Tech, We tried to adjust the soak time and TAL time of reflow profile, but it doesn’t seem to help much.
Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef
The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking
Electronics Forum | Wed Feb 08 09:43:08 EST 2023 | charles_nguyen
Thank you for the above information but what I want to talk about is the PCB design aspect. Should there be any warning about it in the DFM?
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Sun Feb 24 11:16:12 EST 2019 | proy
Guys, I have been down this road also spent a lot of time working on this. Electrolytics often are difficult to solder like this. For the sake of testing, try a water soluble more active flux as an initial test. IF you compare hand solder wetting the
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
