Electronics Forum: custom (Page 204 of 408)

Solder joint strength

Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph

Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Thu Nov 04 09:00:01 EST 2004 | russ

As stated by others you are out of IPC compliance, However, There are allowable deviations to the standard as long as the purchaser and manufacturer come to agreement that the non-conformance will not affect form fit or function. I would recommend

Lead Free Component Finishes?

Electronics Forum | Mon Nov 08 12:12:21 EST 2004 | davef

Your customer's cost will increase. Consider: * The majority of no-lead components have matte tin solderability protection. Bright tin, as mentioned by an earlier poster, has had reliability issues. Many component suppliers have documented their re

Siemens Nozzle Cleaner

Electronics Forum | Wed Dec 01 09:13:05 EST 2004 | stefwitt

As far I know, Siemens has a patent for the joining method of the plastic nozzle and the ceramic tip. It is not glued together. Unless you use an acid dissolving the plastic, you may use any cleaning method and the nozzle shouldn�t come apart. Howeve

DEK/Tannlin Vectorguard stencils

Electronics Forum | Wed Dec 15 20:17:48 EST 2004 | cmiller

We have switched from IIT pro-plates to QTS stencils. lots of companies provide them. We still buy from IIT, they have been one of the best suppliers we have had. The single axes tightening just does not get it anymore with the super small parts we h

Soldering to Inconel 600 Alloy

Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef

Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.

BGA function test

Electronics Forum | Wed Dec 22 10:18:52 EST 2004 | tonyfox

Our company laser re-ball's BGA down to 100 microns ball size. One of our OEM customers have asked us to function test there BGA on Mobile phone PCB's. Origionally we thought of a test sockets however the sockets interfere with other devices on the P

Fuji Flexa with Aegis Circuticam (USERS)

Electronics Forum | Wed Dec 29 17:58:30 EST 2004 | carterhoward

Hi All, We�re a C-M and have been using C-Cam for about 4 or 5 years now. We we�re one of the first customers on there 16 bit platform, so we�ve seen a lot of changes. Our company runs Philips with PPS, and C-Cam has been a rock sold platform. As f

Surface mount Machines

Electronics Forum | Thu Mar 03 03:49:38 EST 2005 | Rob

Hi Greg, That's no real reflection though is it, in Europe you can't move for Europlacers these days. Just down the road from us a company has a couple of 928's that have been running since the dawn of time with no problems, & I can think of a hug

Reball BGA process flow

Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ

This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi


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