Electronics Forum | Mon Jul 18 16:58:31 EDT 2005 | Gpe. E
Hi everybody. I would like to know if any of you guys is using the HP5DX output processor from Assembly Expert to generate de .NDF files for the 5DX machines. I tried but I got a lot of errors because de configuration file for that processor needs
Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper
Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t
Electronics Forum | Wed Aug 10 08:10:39 EDT 2005 | davef
Comments are: * Sounds like it's necessary to clean "heareous F381, F352 no clean solder paste" in your application. Consider a paste that may be better suited to your application. * If you're cleaning "low residue flux", consider using an organic ac
Electronics Forum | Tue Sep 06 10:20:33 EDT 2005 | slthomas
I love these stories. At my previous employer we experienced intermittent failures on an audio microprocessor assembly being used on a *new* product. This board had numerous microprocessors and complex firmware aboard. They discovered one PLCC on
Electronics Forum | Thu Nov 24 01:45:44 EST 2005 | pavel_murtishev
Good morning, My advice is to put two Topaz-Xii in line. Machine programming is rather easy (with PPS and GPP that AssemleOn offers), but final teaching on machine is strongly required. If you want to prepare programs fully offline you�ll have to pu
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
Electronics Forum | Mon Feb 13 10:33:57 EST 2006 | fredericksr
Hello, I am automating a process on our floor from wire solder hand application to dispensed paste and reflow. The process involves "lidding" a shielding lid around our assemblies for microwave quieting. The result is non-hermetic. For cosmet
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Electronics Forum | Fri Apr 21 09:07:50 EDT 2006 | Timothy
My company is currently using point source soldering of SMT components. We have seen some problems due to improper soldering and are looking to switch to a reflow oven/hotplate assembly. Our PCB's range in size but are no larger than 5"x5" and we as
Electronics Forum | Sun May 28 19:02:11 EDT 2006 | grantp
Hi, One thing, getting back to the original topic, is you might want to panelize these boards as much as possible, as you don't have too many components, but you have some good volume. So the machine changeover time is going to be an issue. Althoug
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