Electronics Forum: ipc (Page 205 of 282)

Re: Gold embrittlement

Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup

Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,

Re: Wow! Those are low limits.

Electronics Forum | Thu Nov 11 17:17:11 EST 1999 | Boca

1. Most ionic testing is measured in NaCl, that is, the ionic residues are quantified in terms of NaCl equivalence. The test does not determine what the ionic residue is, just its relative strengh. 2. I use IPC cleanliness specs on OA fluxes but n

More Site Promotion

Electronics Forum | Tue Sep 28 06:46:21 EDT 1999 | Earl Moon

I have a keen interest in the whole SMTNet experience and its potential. The latter is being realized daily and, hopefully, will continue. I do have a big concern about the editors forum and SMT Express. Simply, there's not enough involvement. When

Re: Ic's sesitive to moisture

Electronics Forum | Thu Sep 23 10:28:48 EDT 1999 | Wolfgang Busko

| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci

Re: Tombstone

Electronics Forum | Tue Sep 14 13:27:57 EDT 1999 | Scott S. Snider

| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: track/pad layout

Electronics Forum | Wed Sep 01 14:15:27 EDT 1999 | Dave F

| Help | | I have just received some PCBs with external tracks entering SMD pads at all angles, tangents + 45 degs etc. | | Where can I obtain information as to how tracks should enter SMD pads.? I have looked at several IPC books and got some mino

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko

| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but

Re: Solder Beading Solder Balling

Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko

| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same


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