Electronics Forum | Fri Jun 09 15:46:34 EDT 2006 | samir
I say: �Wave flux needs to be heated to certain activation temps which won't be repeatedly achieved with a manual soldering process. Plus, you won't burn off any residual activator as you would if the board were immersed in a solder bath.� Muse say
Electronics Forum | Tue Jun 13 04:46:15 EDT 2006 | AR
Has anybody else noticed a problem with Assembl�on's mechanical 12 mm feeders, with 4 mm pitch? We are experiencing grave pickup problems with a MELF diode packed this way and fed with this type of feeder. If I attach a hefty weight to the blister ta
Electronics Forum | Tue Jul 18 16:40:09 EDT 2006 | dphilbrick
We have a system where when we set up the line to run a job before the first part is placed an auditor verifies we have all the correct parts loaded on the machines in thier correct locations. We then run a first article. The board is inspected to in
Electronics Forum | Sat Aug 12 20:47:50 EDT 2006 | Efren
Hi Guys, A few months ago I posted a question about a New Assembly Line, and It was great the answers I received. Now I would like to have an additional advise, to complete the requirements of my financial. We expect to install approximately 6 Pick
Electronics Forum | Fri Nov 03 11:06:13 EST 2006 | rgduval
The process that burnt the tips up yesterday was hand soldering/touch up of lead-free assemblies. Not even assembly, but just touching up boards that we've soldered on a solder pot...which will lead to another question. We're using SAC 305 WS482 3
Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea
I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
Electronics Forum | Thu Dec 07 13:51:59 EST 2006 | ganoi
I need advices as to how a gap between the bottom of an LED (1209-package) and the PCB can be controlled on a small rigid-flex PCBA? The problem that we experience is due to tight tolerance in the design of our molded housing in which this PCBA is as
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Thu Dec 21 10:20:44 EST 2006 | Mike F
I realize this is not a board assembly question, but I'm hoping some of the people that read this forum can offer some suggestions for me to evaluate. I need a way to mark wire numbers on shrink sleeving that does not have the name Brady anywhere i
