Electronics Forum: can (Page 2069 of 2411)

Wavesoldering capability study

Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir

Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process

PC Board Marking

Electronics Forum | Thu Jul 19 05:10:05 EDT 2007 | chrispy1963

If you have a adhesive application machine such as the Creative Automation machines we use on our SMT lines you could do as our company does. We pick a corner or an empty area on the board and apply a series of dots specifying the version you are bu

GSM won't change nozzles ...

Electronics Forum | Mon Jul 09 11:19:07 EDT 2007 | swag

I could be wrong but I don't believe that you can start with any empty spindles. If it picks up nozzles, you will end up with more than one empty changer hole which will not work for the vacuum that is required to remove the nozzles from the spindle

PCB exhibit internal short - x-section find cu residue

Electronics Forum | Mon Jul 16 16:39:17 EDT 2007 | davef

We doubt that entrapped process chemicals cause under-etch. Over-etch maybe, but not under-etch Under-etch is an indicator of improper process control/improper chemistry during etching. Under-etch can result in bridging between traces, resulting in

BGA - Unmasked Vias

Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag

I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 09:27:15 EDT 2007 | losersk8er

Sorry I have just started working in this industry so I am not as familiar with everything. The probelm is with the Product shorting because of small pieces of metal stretching accross two leads of an IC. This could be a result of faulty equipment?

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er

The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l

SN100C wetting problems

Electronics Forum | Fri Jul 13 12:32:14 EDT 2007 | rgduval

We've experienced this issue with SN100. A couple of things we've tried, all with varying levels of success: 1. Longer pre-heats. We use SN100 in a solder pot, and pre-heat the boards on our wave machine. This did have a positive effect, but I ne

lead free components in leaded process

Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963

I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead

lead free components in leaded process

Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman

Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o


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