Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
Electronics Forum | Wed Feb 07 16:14:54 EST 2001 | Antonio
I've recently read a posting here which said that the person was trying to reduce solder balls. One of the things the person had done was to adjust the reflow profile so as to be hotter and longer in the reflow state. Am I wrong here? I thought th
Electronics Forum | Thu Feb 22 12:42:02 EST 2001 | moncav
Dear SMTneter's; I am looking for a few board manufacturers to evaluate a new product. This device is a tooling fixture that conforms to any board profile for support during single or double side printing or placement. It's clean, simple and very r
Electronics Forum | Thu Mar 08 22:24:45 EST 2001 | davef
Sounds like you've done a good job of troubleshooting. Two thoughts are: 1 An alternative to using a hotter flux that the others mentioned is to use components with more solderable terminations. [A firm grasp on the obvious.] 2 You spoke about
Electronics Forum | Thu Mar 15 21:29:06 EST 2001 | davef
That you can solder the test points with a little extra flux and a good blast of heat makes me think there is nothing fundamentally wrong. I'd guess there is oxidation on some test points that is a little crustier than others. You might be able t
Electronics Forum | Tue Apr 10 11:39:29 EDT 2001 | brownsj
One of the reasons for a grainy joint is the cooling of the joint after reflow. Check your reflow profile, not just the preheating and reflow section but also the cooling zones. It works the same way as molten rock. If it cools slowly you get pumice
Electronics Forum | Mon May 28 17:43:33 EDT 2001 | davef
Does this device have a integral heat sink / metal slug on top, like a TI TM320C6XXX er a Altera EP20K4XX? Compare the size of the pads on the interposer and the board. Compare the type solder mask [NSMD vs SMD] on the interposer and the board. Wh
Electronics Forum | Fri Aug 30 04:53:08 EDT 2002 | jason
Hi Dr Lee, Recently, I was assigned to use Ag imm. PCB using 63/37 solder paste without Ag. The results were not fantastic. Surface finish was rough and lots of wetting issue. The oven profile soaking time was set at 70 secs above 183�C and Max tem
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
