Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F
I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu
Electronics Forum | Tue Aug 01 00:34:45 EDT 2000 | Antonio
I have evaluated SRT, Air-Vac and Conceptronic rework stations. All three machines offer great BGA and Micro BGA rework capability. But the one I have preferred is the Conceptronic Freedom 2000, as a matter of fact I have purchased two freedom 2000 i
Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F
There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question
Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Thu Apr 13 18:28:01 EDT 2000 | Michael Parker
Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Fri Nov 26 03:29:00 EST 1999 | TIM GOODMAN
HI WELL WE HAVE PLACED BGA,S AT A COMPANY ON A TRIAL BASIS, THE ONLY PROBLEM IS THAT YOU USE A PART DATA WITH A SQUARE PART IE PART TYPE 2 WITH A VERY SMALL BODY TOL .THIS WORKS WELL ON LARGE BGA,S BUT PLEASE PRE ROTATE AND MOVE AS SLOW AS POSSIBLE.
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Thu Sep 23 13:47:14 EDT 1999 | Terry Burnette
| | I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | | | I Hope than you send my information about this. | | | | | Try this Link http://mot-sp
