Electronics Forum: anticipation (Page 3 of 7)

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F

Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u

Scored Panel Depth

Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef

IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285

Micro-BGA soldering

Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L

Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg

Re: Water Batch Cleaners

Electronics Forum | Fri Jun 25 08:44:01 EDT 1999 | Graham Naisbitt

| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components

Re: pitch

Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F

| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1

Lo Behold Voids!!!!

Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez

hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr

Check out the newly automated SMT Library and SMT News

Electronics Forum | Mon Apr 12 15:51:16 EDT 1999 | Cunli Jia

To All, Good news: now you have a place to easily share your papers, articles, news, etc. on SMTnet. We have just finished automating the SMT Library and SMT News. Although both are still in Beta testing, and we anticipate some errors, they are re

Check out the newly automated SMT Library and SMT News

Electronics Forum | Mon Apr 12 15:49:03 EDT 1999 | Cunli Jia

To All, Good news: now you have a place to easily share your papers, articles, news, etc. on SMTnet. We have just finished automating the SMT Library and SMT News. Although both are still in Beta testing, and we anticipate some errors, they are re

Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo

stencil ordering

Electronics Forum | Sat Oct 26 08:01:17 EDT 2002 | davef

IIT is a reputable supplier. They will be more than happy, happy to help a newbie get a good product. Continuing, at one level of product design sophistication ordering by remote will provide you with a perfectly acceptable stencil. But on the o


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