Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten
Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Fri Feb 01 10:54:35 EST 2013 | dyoungquist
Regardless of the surface finish, you should try to limit the reflow cycles to 3 with no more than 5 at most. This includes reworking a BGA site as well. Remember that heating/cooling to remove a BGA is one cycle and heating/cooling to place a BGA b
Electronics Forum | Thu Apr 14 15:33:41 EDT 2022 | ppcbs
I've never lost memory in a BGA from heat removal. However we can create a profile on our BGA rework stations to remove using bottom heat only. This exposes the BGA body to temperatures of around 190 to 200C. I have a colleague that has a machine
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Fri Jun 14 14:29:22 EDT 2002 | davef
Russ makes good points. Search the archives for: * Links to rework machine profiles. * Discussion on people causing corner shorts on their BGA, when heating them too rapidly, making the corners to curl like potato [potatoe?] chips.
Electronics Forum | Tue Jan 29 08:18:47 EST 2013 | cyber_wolf
Unless you use the method Evtimov described, you will be guessing. And yes metal topped BGA's take heat differently than PBGA's
Electronics Forum | Tue Jul 14 13:23:59 EDT 1998 | Tom
I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. General
