Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Wed Feb 01 03:17:10 EST 2017 | rob
Ok, that's small - I think you may need a special semi-conductor printer for this - positional accuracy on a "normal" SMT printer is no more than 20 micrometres from memory. In my semiconductror fab days we were printing with a positional accuracy
Electronics Forum | Wed Feb 01 11:33:37 EST 2017 | emeto
Joshua, 100um is 4mil aperture. You should ask several stencil houses about the possibility to print that small amount of paste(type 6 paste is available now with very small solder spheres 5-15um diameter). Even applying small amount(thin layer of f
Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Thu Apr 27 03:23:25 EDT 2006 | ge_lim
According to seho, for multi dipping the process window is very small and they would prefer drag soldering which has a wider window. What is your view on dip vs drag? Why? Other machine user also share the same suggestion?
Electronics Forum | Fri Feb 24 15:11:18 EST 2006 | stepheniii
It's been a while, but I thought it was set up with on the screen, and not with dip switches. I'm sure with later models it was but can't remember the menu selections to do it.
Electronics Forum | Fri Feb 24 13:44:16 EST 2006 | yiannis
hi, Can anyone tell me there are the switches that configure the RS232 communication with computer ? thnks
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN
Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
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