Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Wed Oct 23 15:50:31 EDT 2002 | bdoyle
Hi Terry, You can post the article in the library component on the site. If you also send it to me via email (bpdoyle@smtnet.com) I'll look it over for next month's express.
Electronics Forum | Thu Oct 24 11:19:31 EDT 2002 | nifhail
thanx Randy.. But Terry how can I get the chnace to look at the paper that you are going to publish. thank you.
Electronics Forum | Wed Jan 26 09:27:41 EST 2005 | davef
Look here for more on dye & pry: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef
It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
