Electronics Forum: overprint (Page 3 of 10)

type 3 vs type 4 paste

Electronics Forum | Fri Nov 08 17:10:04 EST 2002 | rspoerri

Is that square inscribed or circumscribed with respect to the pad? It sounds like you're saying circumscribed (overprint) given the volume comment. Wanted to confirm though. Kim

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:25:19 EST 2002 | russ

We actually look at it like this, The area of a circle that will fit into a square is less. (slight overprint with square aperture with radiused corners) Russ

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 13:50:01 EDT 2005 | russ

You will want the square in this case to be .013" with rounded corners (slight overprint). I do not see why you would need a type 4 paste for this. the aperture as it sits should release well but obviously there is something wrong.

Tombstone caused by flux residue

Electronics Forum | Thu Jul 14 16:15:04 EDT 2005 | russ

Can flux really prevent wetting? This seems odd to me. I am actually thinking the opposite of Bman, I am wondering if using a homeplate with an overprint condition might help? Russ

Overprint, solder flow back

Electronics Forum | Wed Dec 06 06:09:02 EST 2006 | Loco

Would say about the same as above, 8mm according to a cookson presentation we had, of course it would depend a bit on the paste you are using.

UBLOX Tim-4A reflow problem

Electronics Forum | Mon Dec 11 08:52:11 EST 2006 | beta

Hi, I checked out your component.They are differnet dimensions. You say you are not using the recommended overprint ? if this is the case, I would imagine that is your problem. If you want to contact me off line to discuss further plesae feel free.

100% solder coverage

Electronics Forum | Thu Sep 13 01:37:15 EDT 2007 | pavel_murtishev

Good morning, Overprint, i.e. make stencil openings for your LED larger. Add printer accuracy to aperture size so that paste would always cover the pad. BR, Pavel

QFN soldering

Electronics Forum | Thu Apr 05 07:46:18 EDT 2012 | aj

if you want to get some sort of a joint even to allow AOI to inspect you can overprint on on the outer lead by 3 thou or so. This will give you a joint that can be seen from the side for inspection purposes.

Small apperture release from stencil

Electronics Forum | Fri Feb 15 12:29:35 EST 2013 | mikesewell

What foil thickness? Type 3 or 4 paste? Have you checked your area ratio(s)? You could overprint or drop your foil thickness by one mil to improve the ratio and paste transfer. As always you can search the fine SMTnet archives for more info.

Aperture shape for DPAK

Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap

Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.


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