Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Fri Aug 25 08:12:16 EDT 2006 | davef
Leading conveyor manufacturers are ATI, Conveyor Technology, Crown Simplimatic, Dynapace, Flextek, Fuji, Jot, Kanetic, Panasonic, and Process Control.
Electronics Forum | Mon Nov 02 07:59:32 EST 2009 | shannond
Contact Greg Frazier at Automated Technology Services, he may be able to help you. He's been fixing my Fujis for a long time. greg.frazier@ats-smt.com
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert
I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Thu May 28 10:57:10 EDT 1998 | John
Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. Here's what we are in the market for: Low/Mid volume 3,000+cph machine that can handle high job fle
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Wed Mar 10 11:43:11 EST 2004 | Bill Aldeen
My name is Bill Aldeen, and I own and operate Nu-Way Electronics, Inc. We provide Tape & Reel packaging service for surface mount and through-hole electronic components. We're in the Chicago area, and we serve all of North America competitively. W
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
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