Electronics Forum | Tue Feb 14 18:02:02 EST 2023 | cyber_wolf
The slower the squeegee speed the more tendency for "drag out" Raise the print speed and pressure. Rule of thumb 1.5 to 2 LBS squeegee pressure per inch of blade to start. OR try 2 passes with the squeegee.
Electronics Forum | Thu Jun 25 12:04:58 EDT 1998 | Brian Munzel
looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. thanks for you time
Electronics Forum | Fri Jun 26 11:01:47 EDT 1998 | Justin Medernach
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian, Call me. We'll chat. Tons of stuff. 978 392 3218 East coast time. Regards, Justin
Electronics Forum | Tue Apr 06 10:30:48 EDT 1999 | Scott Davies
Tony Although I agree in principle with Dean that 45 Degrees would be ideal, most of the squeegees I have worked with have been 60 Degrees to the stencil surface. This seems to work best with metal squeegees when printing HASL boards, because the sl
Electronics Forum | Wed Sep 01 12:07:31 EDT 2010 | davef
Printing solder paste * Use single stroke, on-contact print cycle * Ensure the substrate is well supported, especially under areas of fine pitch print. * Select pressures of about 1- 2 lbs per linear inch of squeegee blade [Set squeegee pressure hig
Electronics Forum | Tue Mar 20 10:27:36 EDT 2007 | davef
Print styles: Print - Most common print mode * A single print stroke forward on first board * A single print stroke reverse on next board Print-Print (Double Print) * Both forward and reverse printing strokes * Helps to ensure complete filling of th
Electronics Forum | Tue Jan 09 13:54:10 EST 2007 | jdengler
Hi All, I'm having a problem with a Fuji GP-341. It has squeegee pressure control using a TEAC TD-320A comparator. I cannot get it to measure printing pressure. On the TD-320A it normally reads "2512" then flips to "oFl4" then back to "2512". If
Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel
Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
