Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Sat Jul 31 08:52:15 EDT 2004 | g2garyg2
I am soldering with a softbeam laser and often get a flux/solder build up at the end of the feed tube. Seems better when we use Senju wire but this is very costly. It seems like we have tried everything to resolve this. Would appreciate assistance on
Electronics Forum | Thu Apr 01 15:31:23 EST 1999 | Brian
B: Edsyn make a nice tool to Solder Dress, check out the TSX-70. It'll blow and suck at the same time! | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardo
Electronics Forum | Tue Jun 02 17:59:01 EDT 1998 | Dave F
| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon What methods do people use to dress pads after removing and before replacing the
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212
but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire
Electronics Forum | Thu Jun 22 09:50:48 EDT 2017 | capse
Are you using nitrogen in your soldering process?
Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5
Try baking the boards; you may have a moisture problem.
