Parts & Supplies | SMT Equipment
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S51
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
.jpg)
Parts & Supplies | Pick and Place/Feeders
J1301023 E-RING J1301151 HEX NUT J1301154 FLAT WASHER J1301155 STEEL BALL J1301157 FLAT HEAD CAP SCREW J1301161 FLAT HEAD CAP SCREW J1301164 BEARING J1301266 HEX NUT J1301448 FLAT HEAD CAP SCREW J2500009 STEEL B
_1.jpg)
Parts & Supplies | Pick and Place/Feeders
FUJI CLAMPER wire rope iron block PT01871 Other FUJI parts: 360 H4445D BEARING, MINIATURE 1 AA5NC12 361 PM0D3X1 PIN 1 AA5NC12 362 PM97983 PIN 1 AB00106 363 AA8FR00 BKT, SENSOR 1 AA81S19 364 20406090131 PM048F1 SLIDER 1 AB00106 365 K5359H
_1.jpg)
Parts & Supplies | Pick and Place/Feeders
CP642ME steel wire belt WQC5591 3250MM FUJI CP742/CP743/CP8 X BALL SCREW DGSX0050() FUJI CP742/CP743/CP8 Y BALL SCREW DGSY0060 FUJI CP742/CP743/CP8 X GUIDE RAIL DGSX0041 FUJI CP742/CP743/CP8 X GUIDE RAIL DGSY0071() FUJI CP742/CP743/CP8 Z BALL
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
