Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini
Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l
Electronics Forum | Mon Mar 17 10:36:04 EST 2003 | davef
Ramanandkini 14 gm versus 5 gm: 14 gm [even 10 gm] sounds better than 5 gm. We get good bond pull XBAR (high teens) and low sigma (
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Mon May 10 23:10:40 EDT 2004 | yvonne heng
Hi Jon, well,i think that wirebond is still the best option at the moment since it is more flexible unless size is one of the important factor.
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse
Plasma cleaning is used extensively to clean surfaces prior to wire bonding.
Electronics Forum | Fri Jan 03 08:19:24 EST 2003 | emeto
hi, for more info try one of these if you missed some: http://www.amkor.com/ http://ap.pennnet.com/ http://www.asymtek.com http://www.smta.org/ http://www.semiconductor.net/ http://www.smtinfocus.com/ http://www.elis.rug.ac.be/ http://www.kns.com
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
