Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon
| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is
Electronics Forum | Mon Nov 02 17:14:52 EST 1998 | Thomas Clift
Thanks for your reply. I am interested in knowing about maintenance schedules and levels. I'm wondering how to know if I must replace a part. What part? What type of lubrication (for Fuji). Etc. My company is small in terms of number of lines and th
Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Wed Sep 23 13:27:55 EDT 1998 | Dave F
All y'all, We use two methods to secure/stake jumper wires to boards: 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. 2 Loctite 382 Tak Pak We use Tak Pak "99&44/100ths" more often than the "magi
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Sat Aug 22 01:56:54 EDT 1998 | Lance A. Smalley
Panapro Host Optimization should actually be very good. Make sure you're not using a fixed setup or the feeder carriage will move alot. Also make sure you do not change parts data in the machine after the program has been generated or speed of the
Electronics Forum | Fri Jul 10 13:55:16 EDT 1998 | Bob Willis
After reflow the paste on a copper pad should spread out from its original print dimensions it should ideally not prior to reflow as that is a hot slump. The better the solderability of the OSP or the higher the activity of the flux will greter flow
Electronics Forum | Wed Jul 08 17:31:31 EDT 1998 | Dave F
smd: I think the idiom is "schmuck," rather than "putz." ;-) What are you concerned about? That the residual water in the 80 pin connector housing will flow down the boards and rot-out the bottom of your new boxes? Dave F | I am about to place a
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