Electronics Forum | Sat Dec 18 01:53:46 EST 1999 | sin
If i have problem with tombstone, first i would look at the placement of my components. if placement is 50% greater on the pad, it would be ok to reflow. even you have bad profile, you would have some other problem not tombstone. then i look at
Electronics Forum | Thu Dec 09 15:14:41 EST 1999 | Ron Costa
I have been seeing wetting problems with Texas Instruments componets. I am using Kester 596L OA water soluble solder paste. My reflow profile is in spec. for this formula. Has anybody else seen this problem and if so how did you resolve it? Any feed
Electronics Forum | Wed Nov 24 14:04:50 EST 1999 | John Thorup
Claudio My apologies if I'm wrong but if it looks like an ad and quacks like an ad you must have missed the NO ADVERTISING PLEASE request at the head of the message posting box. If you're trying to make a profit from us it's only fair that SMTnet ge
Electronics Forum | Thu Nov 04 07:04:04 EST 1999 | Pat Copeland
Just started having a problem with the solder on a board. Nothing has changed as far as profile, type of paste or setup. But yesterday we had the boards coming out of the reflow with horrible solder results. It appears on some components the solder i
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
Electronics Forum | Fri Oct 08 13:04:15 EDT 1999 | Dave F
| Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | PCB is FR4 | Solder Mask is LPI | Reflow and W/S Profile = Standard | | thanks and rega
Electronics Forum | Wed Sep 29 22:50:57 EDT 1999 | Dave F
| Hi All, | Any one experince BGA-chipset warp about 10-15mil after removing | from PCB? | FYI, the rework temperature for preheat was 170C from room | temperature about 30 seconds, & BGA was removed at temperature | between 190-200C. | Thankyou.
Electronics Forum | Thu Sep 23 08:59:20 EDT 1999 | Wolfgang Busko
| Hiya, | | Could anyone please suggest recommended manufacturers of | IR rework stations for the removal of various SMT comps. | | Cheers | Why IR ? Ok, I�ve seen only one but that thing burnt the PCB before the solder was melting and costs a lo
Electronics Forum | Mon Aug 30 02:41:22 EDT 1999 | Dreamsniper
Planning to evaluate the above process... Can anyone can give me some tips/infos on the above.... e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different from an ordi
Electronics Forum | Wed Aug 18 11:18:22 EDT 1999 | GREG DENHAM
WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS. IS TH
