Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F
Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Thu Oct 26 17:53:32 EDT 2000 | Dave F
John: I�m here. On "what do ya think about that one!..."??? Mutha, that sounds rat�s rump [as Dennis Miller says] ugly. On some boards, we paste a cuppla chips on the break-away panels and then torque the chips from the board after cure. We use the
Electronics Forum | Fri May 19 11:20:12 EDT 2000 | John Thorup
Dave - well said ScottM - I'm appalled - Your management sounds like a throwback to an early industrial age where the workers were treated as a commodity. It's not right to do only what you're forced to do when protecting human beings and the enviro
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Thu Sep 09 13:31:26 EDT 1999 | Brian W.
| | My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for
Electronics Forum | Tue Jul 27 14:09:51 EDT 1999 | JohnW
| | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | I understand 63/37 to be
Electronics Forum | Thu Jul 29 19:30:44 EDT 1999 | Boca
| | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | I understand 63/37 to be
Electronics Forum | Mon Mar 08 11:46:38 EST 1999 | Wendy Casker
| Hello; | | I am looking for general info on backplane assemblies. Any info would be appreciated, but some of the questions that come to mind include: | | -What part types other than connectors do backplane cards have on them? SMT? Leaded? Qua
