Electronics Forum | Fri Oct 08 07:38:48 EDT 2004 | Paddy
Hello, I am wondering if anybody has process experiance of designs which use the above. I understand that the filled via is an excellent thermal cnductor, which is great from a design point of view, but how do these solder through the reflow ovens
Electronics Forum | Fri Jan 14 12:59:07 EST 2005 | Dan Mendoza
I have used the rectangle shapes and round shapes with no noticible difference. The idea is to design the pads to accept the same solder volume per component. Components over two size pads will favor the higher solder volume side during reflow.
Electronics Forum | Wed Feb 09 10:34:19 EST 2005 | Ron
Is anyone currently reflowing a board with SC44 devices on it. This is a 6pin SAW filter with castellated terminations. I'm looking for a solder paste design for this part. I currently use a laser cut 6mil thick stencil.
Electronics Forum | Wed Mar 09 19:51:28 EST 2005 | KT
Greetings: I would like to know the common land patterns and aperture shapes that are currently in use. We are doing some research on the same. Please respond to the thread if you have a success story with you current design. Thanks KT
Electronics Forum | Thu Apr 14 12:51:45 EDT 2005 | russ
Most likely this can be done if the board does not have any inner layer artwork. Are there schematics available? if so a design shop can basically re-design the board from these.
Electronics Forum | Thu Apr 21 14:06:28 EDT 2005 | russ
Dang Patrick, I'm going to have to agree with you again. The design needs to be corrected. This multiple footprint is a common thing nowadays but the designers need to understand the dynamics of reflow and such. PWH - Why would this mask need to
Electronics Forum | Wed May 25 09:02:20 EDT 2005 | russ
Send your gerber data to the above mentioned or any other pallet Mfgr. If the assembly is designed with pallets in mind I am sure that one can be designed for your application.
Electronics Forum | Thu Jul 14 16:08:07 EDT 2005 | russ
Stencil thickness is related to PCB design and is not related to paste type. If you release with a 8 mil stencil then use an 8 mil stencil. Of course there are pastes that release bteer than other and what not but use area and aspect ratios to dete
Electronics Forum | Sun Aug 28 03:22:35 EDT 2005 | Leo_dektec
We have had this experience in China. Some of our customer produce aluminium radiator. They always ask us to design this type reflow oven for it.Because the large desire of the heat,we have to design the oven at a higher temperature.It's almost meet
Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef
Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards
