Electronics Forum | Tue Jan 02 14:15:59 EST 2007 | realchunks
I have a new customer that has a print calling for 2oz. copper finish for top and bottom layers, and 1oz. copper finish for the inner 6 layers. Now, they also have a stack up depicting each layer and thickness. It shows the outer layers of copper b
Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil
OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave
Electronics Forum | Thu Mar 19 12:22:54 EDT 2009 | mhjohnso
While investigating a routing study for a new bga device, I found the vendor used round 20 mil pads on 0402 decoupling caps.This allows fitting the caps between break out vias on their 1mm pitch BGA. Round pad gives about 8 mils diagonally from pin t
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Thu Sep 16 17:56:48 EDT 2010 | asksmt
Ok Thanks, i have reduced thermal pad size by 4.5 mils on top and bottom part of this footprint where the problem was occuring, so now the clearance between thermal pad and lead pads are 12 mils instead of 7.5 mils on two sides. (i kept the signal pa
Electronics Forum | Thu Jul 31 10:14:27 EDT 2014 | matusov
I know that some board houses have better > capability than others. Some can do down to 4mils > mask in between the leads I think. I know that it > also depends on the type of the mask they are > using - for some types you can't go down to the >
Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Mon Aug 12 21:54:33 EDT 2019 | davef
I've never seen successful printing with a step as deep as you seem to be saying. The keep out would have to be jigundous!!!! SMTnet Technical Library: https://smtnet.com/library/files/upload/Step-Stencils-laserjob.pdf I'd guess * Maximum step
Electronics Forum | Tue Mar 07 17:04:13 EST 2000 | K. Ckak
Hi Steve, I think MIL-P-81728A, MIL-F-14256 and Fed std QQ-S-571/624 talks about it, but it has been superseded by J-STD-006. Hope it helps. Regards Kc.
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
