Electronics Forum: pop (Page 22 of 37)

Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader

We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon

Re: Rework Equipment

Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony

I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type

Re: Solder Balls on 0805 capacitors

Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM

HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc

Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a

Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader

We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon

Re: Rework Equipment

Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony

I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer

Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu

CALCULATION EQUATION FOR 1 CHIP SOLDERING COST IN SMT PROCESS.

Electronics Forum | Mon Jan 17 02:40:17 EST 2000 | park kyung sam

Hi. smtman would someone answer me ? it's just the stuff pop ups without deep thinking. how much do our department spend money for 1 chip soldering. what should i consider ? i wonder i spend more money than other guys out there for 1 chip soldering i


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