Electronics Forum: 2000 (Page 212 of 505)

Re: Looking for feedback from our site users on the Career Center

Electronics Forum | Fri Feb 25 17:25:05 EST 2000 | Brandy Ford

Thank you for your response Michael- I agree with you completely. Though there are fields for the employer to fill out, they are not required fields. Should we make them required? What job that you are interested in that doesn�t have a location

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: Wave Soldering

Electronics Forum | Thu Feb 24 13:12:38 EST 2000 | Dave F

Ver: The best thing I could do is send you to Bob Willis' site (www.bobwillis.co.uk or something like that), suggest that you root-around there and find one of his procedures that will help you, and come back and we'll refine your process. Good luc

0603 Tombstoning

Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker

I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: Stencil printers, what's really out there?

Electronics Forum | Tue Feb 22 19:21:05 EST 2000 | Peter

I like MPM's 500 machine. I purchased the predecessor model when it was made by SMTech. This machine has programmable pin supports which made setting up for double sided boards really easy. For auto alignment, I think only in-line machines have th

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal

Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake

Re: unidentified component

Electronics Forum | Mon Feb 21 22:36:19 EST 2000 | Dave F

Cedric: I know you said "5KE36CA." Motorola, Fairchild, and some others make a zener transient suppressor 1.5KExxCA. The CA suffix makes it bidirectional. Actually, Motorola is no longer in the business. On Semiconductor (www.onsemi.com) sells t

Re: Reliability of power module soldering

Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z

First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou


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