Electronics Forum | Tue May 15 14:23:20 EDT 2001 | medernach
Again, I'm not familiar with your material but SMT Adhesives as a collective group are typically hydroscopic. An increase in humidity in your facility will lower the viscosity of certain materials. I don't want to say who's material I've had bad ex
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Fri Jan 07 09:49:54 EST 2000 | John Thorup
www.speedlinetechnologies.com
Electronics Forum | Wed Oct 20 15:47:14 EDT 1999 | Shane
I am developing a D.O.E for Surface Mount Adhesives and was wondering if anyone out there had any recommendations on a certain brand. I currently have samples of Loctite 3609, 3615, 3618, Heraeus PD955M and MA-420 by Lord Chemicals. I understand Ci
Electronics Forum | Mon May 24 13:06:12 EDT 1999 | Deon Nungaray
| | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing them o
Electronics Forum | Fri May 28 11:35:23 EDT 1999 | Robert Wells
Scotty, What type of glue machine are you using? Thanks in advance, Robert
Electronics Forum | Fri Apr 02 09:26:15 EST 1999 | Carol Brumfield
Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive?
Electronics Forum | Tue Mar 30 02:32:42 EST 1999 | Scott Davies
We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage of
Electronics Forum | Thu Oct 22 15:10:00 EDT 1998 | Chris Fontaine
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
