446 depanelization results

Electronics Forum: depanelization (Page 22 of 45)

Laser Depaneling / Routing

Electronics Forum | Fri May 26 17:05:38 EDT 2006 | pjc

Chunks, FYI: I don't sell them. I sell the mechanical type from Cencorp. I just know about LPKF's machine. They should be able to give you the info you're looking for.

V-groove question

Electronics Forum | Wed May 24 17:53:05 EDT 2006 | slthomas

When the fab people cut a V-groove for depaneling, do they use a lubricant on the router or do they cut it dry?

Trace Distance to Board Edge

Electronics Forum | Mon Jul 30 12:12:48 EDT 2007 | davef

If you do everything correct depaneling, features should be kept 0.025 thou from the score line.

Resonator Cracking

Electronics Forum | Fri Nov 16 08:47:04 EST 2007 | rgduval

Fractured parts that we've seen at reflow in the past are related to trapped moisture in the part, out-gassing at temp, and fracturing the part. I have seen this on ceramic resonators in the past; don't know why this type of part seems prone to this

PCB Depaneling Router

Electronics Forum | Fri Feb 29 18:04:05 EST 2008 | davef

For those wanting to fill-out their basic understanding of flexible circuits, there's a pdf version of Joe Fjelstad's 3rd edition of "Flexible Circuit Technology" is available for download here: http://www.flexiblecircuittechnology.com/

Min spacing for land patterns from PCB edge

Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw

Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!

Min spacing for land patterns from PCB edge

Electronics Forum | Mon Mar 24 12:11:38 EDT 2008 | scombs

Is this what you are looking for? We do this on quite a few boards and it has eliminated component problems from the Cab depaneler (pizza cutter)

BGA cracking

Electronics Forum | Thu Sep 25 16:50:50 EDT 2008 | glennster

Ditto here, also. This is generally referred to as �cratering,� and is associated with stress on boards from operations such as ICT, installation of compliant pin connectors, and depanelization. It is more common on PCBs designed for Lead-free proc