Electronics Forum | Wed Aug 26 14:41:44 EDT 2020 | emeto
Part library is big enough problem. Whatever machine you pick you will be able to transfer XY, Theta coordinates as well as reference designators. This will help in programing a little, but this is all you will gain. all packages, vision algorithms
Electronics Forum | Mon Nov 09 22:25:04 EST 2020 | compit
I don't know about here, but in YV100 the drive is on ATA PCMCIA flashdisk. Maybe it is underpressed / damaged? Or after replacing the battery on mainboard, you need to enter its parameters in the BIOS.
Electronics Forum | Wed Apr 14 13:39:08 EDT 2021 | SMTA-64387124
I am working with a CM in Taiwan and we are seeing significant differences between the paste printing bon the forward stroke vs the backward stroke. Print parameters are the same (pressure, speed, snap off speed) but there is a significant difference
Electronics Forum | Wed Feb 02 21:32:13 EST 2022 | chuckphd53
The rotation is a fixed parameter..... and of the 9 parts, randomly it will skew the part, could be one or more... I was thinking maybe the solder paste was too dry and during the LIFT after placement it would blow the part sideways.. Yes I am on a
Electronics Forum | Mon Jul 04 13:56:23 EDT 2022 | madisreivik
Actually its one part. I had an idea to test some completely different, pre-defined component which has been placed on that machine before. Do You suspect there is a diabolical shape parameter somewhere ? :)
Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.
Electronics Forum | Wed Nov 02 11:42:54 EDT 2022 | bobpan
check 'machine' then 'parameters' and make sure 'part check wait delay' is set to 0. Also I would turn off CDON usage in 'ANC' for each head. If they are set to 'YES' change them to 'NO' and see what happens.
Electronics Forum | Tue Mar 07 20:33:26 EST 2023 | SMTA-72027903
Hello We have recently started to work with press fit but we are finding problems to reach the specifications in terms of hole deformation and whiskers. Do someone have experience in key process parameters and PCB design specifications (PCB harness,
Electronics Forum | Mon Jul 17 09:09:42 EDT 2023 | tommy_magyar
Things I would check: - solder paste - reflow profile - stencil printing parameters including support, stencil itself and squeegee - MSL procedures - inspection between pick and place and reflow to check paste printing (ideally SPI) Hope this h
Electronics Forum | Fri Sep 22 12:11:31 EDT 2023 | wippsen
Hi there, if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too l
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