Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Fri Oct 30 18:08:59 EST 1998 | Dave F
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
Electronics Forum | Fri Jun 12 14:22:53 EDT 1998 | Ryan Jennens
| Hey all! | The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pall
Electronics Forum | Fri Jan 16 23:46:38 EST 1998 | Scott
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon Aug 04 14:17:18 EDT 2008 | grics
Patrick, you are right. I am sorry. It is a Water based flux. (We have another no clean flux indium 3592 that is used in our leaded process. It is alcohol based and had their base confused) Chunks, yes, this has always been a problem. If ther
Electronics Forum | Tue Feb 19 19:36:21 EST 2002 | davef
You weren�t clear but I assume the problem is not widely distributed and affects only a few parts on each board. Do this trick: * Cut a ~1� piece of fairly serious wire, like 18 or 12 AWG. * Strip the insulation. * Gear-up with gloves, glasses, and
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina
Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past
