Electronics Forum | Fri Mar 28 22:01:00 EST 2003 | MA/NY DDave
Hi Yes I agree, yet this subject is about Tombstoning and oven profile or even oven working correctly across the entire product is a sub-set of how one gets those little chip babies to sit and stay where they belong. Flat and Heeling like their mast
Electronics Forum | Mon May 26 04:02:13 EDT 2003 | Franky
Dear sir, I think so with every idea , everyone is correct , paste , pattern of pad design ,profiling or solder mask on PCB ,and one of the cause of tombstone that I found is alignment of machine placing and solder printing , from my experience many
Electronics Forum | Thu Aug 28 20:24:30 EDT 2003 | yukim
Hi, do you know how much the problem can be reduced by using anti-tombstoning solder paste? I tried two different lots using same solder paste (containing Ag). With one we did not see any improvement and with the other one, a lot. So, I am not quite
Electronics Forum | Thu May 29 10:42:40 EDT 2003 | swagner
So is it fair to say that on a moisture laden double sided flex circuit you could see an increase in tombstoning on the 2nd pass due to warpage created by delamination? In other words a 0603 for instance could tombstone due to the delaminated surfac
Electronics Forum | Fri Jul 11 03:35:44 EDT 2003 | emeto
Hi there is one thing. I had the same problem before and after examine it I found the problem is in the pads. The pads on the board were bigger then usual and the distance between them also was a little bit longer.Theese two are the best precondition
Electronics Forum | Thu Jul 14 13:05:18 EDT 2005 | Bman
Considering all the constraints you are faced with, I would try changing the apatures for that part on the stencil. It seems as though a no-clean "homeplate" appature would put less paste on the board. Less paste means less flux, and it might be en
Electronics Forum | Sun Sep 11 05:48:32 EDT 2005 | Mika
If 0 or 180 degr. make v-shape openings to each other left & riht, if 90 or 270 degr. top/ bottom, on the stencil apertures; well, you understand... We use this and 87 % reduction of stencil apertures for 0603:s and 0402:s. 0.127 mm stencil thicknes
Electronics Forum | Tue Jan 17 16:09:18 EST 2006 | geb
Tombstoning is usually caused by one joint heating to melting point before the other. Is it possible to have a lower temperature for the heat zones on the underside of the panel, so the paste is less likely to reach melting point. Does there appear t
Electronics Forum | Wed Jan 18 09:18:49 EST 2006 | samir
I had the same exact problem recently. I did exactly as the gentlemen said, and reduced the B/S zones 20 or so degrees, AND changed to medium convection. I'd like to point out that the B/S components still go liquidous (such is the Physics of convec
Electronics Forum | Mon Jun 16 23:57:47 EDT 2008 | grantp
Hi, How has it worked for you with small parts such as 0402, and are you using these size parts, and getting any tomb-stoning problems? We used lead paster with our vapor phase, while lead free should have less surface tension, so I have always won
