Electronics Forum | Mon May 24 05:53:24 EDT 2004 | johnwnz
Here's an interesting fact, some pastes just don't wet as well as others!.. there I've said it and now people will complain but that's life. Some pastes are formulated to run in air, some in N2, soem are specifically designed to be more aggressive fo
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve
I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Fri Jul 13 12:32:14 EDT 2007 | rgduval
We've experienced this issue with SN100. A couple of things we've tried, all with varying levels of success: 1. Longer pre-heats. We use SN100 in a solder pot, and pre-heat the boards on our wave machine. This did have a positive effect, but I ne
Electronics Forum | Tue Mar 23 15:46:28 EDT 2010 | pilusa
The AIM flux is for the process and not for the tip tinning. The flux I was referring to is what is used to keep the tip wetted which was one of your original problems. Regarding the process, in my experience the AIM flux is not very active and there
Electronics Forum | Wed Sep 07 00:47:53 EDT 2011 | woodsmt
PCB, What is telling you that you have cold solder? You do not give much info. My QA/QC love this term to describe a multiple of issues. They are usally very wrong. If this is a reflow process and it just affects one part? An SSOP is not likley t
Electronics Forum | Thu Jun 15 06:58:54 EDT 2017 | cyber_wolf
Hmmm.... When I clean my stencils after I run a job, it is to clean the paste off the stencil so it doesn't dry out in the apertures and on the stencil surface while it is being stored. Wiping the stencils during production is to clear the paste of
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
