Electronics Forum | Tue Mar 25 17:37:59 EDT 2008 | hussman
If the component "fell off" sounds like double sided reflow - which is most likely a profile issue. If the parts just don't solder, could be many variables. I've had supervisors accuse ovens for bad profiles cuase they had missing parts. Too bad
Electronics Forum | Tue Apr 15 17:02:52 EDT 2008 | aj
Hi, We run with two five zone ovens , so far we have managed fine. Like yoursleves , we are not under pressure for high thru put but I have no doubt this is something that we will have to look at in the future. What sort of settings do you have at
Electronics Forum | Wed Jul 16 10:34:19 EDT 2008 | kevslatvin
I would think you could contact Novastar as they are still around. We used to have an APS P&P machine(which is part of Novastar)and now have a Novastar reflow oven. Thay have always been good to work with for tech support/parts. Their website is here
Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Tue Aug 26 07:39:54 EDT 2008 | evtimov
thanks. i was looking at the silicon horizon > controller for the toaster. just to help keep the > temp constant since i can not watch it all night! this way of baking is good just for small quantities. If you want to built a lot of boards, you b
Electronics Forum | Fri Sep 05 10:31:22 EDT 2008 | realchunks
Without knowing your board, oven or profile, I would suggest working the middle of your profile. Try a slower conveyor speed to increase your soak zone of your profile. This will decrease your delta-T across the board. You may also have to work on
Electronics Forum | Sat Sep 20 07:11:28 EDT 2008 | Sean
Hello All, I used to hear that PCB with immersion silver finishing, its non component location pads, tend to be discolour (Yellowish) after went through heat cycle, such as reflow oven. However, if the component solderbility on the PCB is OK, can w
Electronics Forum | Tue Oct 14 11:53:09 EDT 2008 | slthomas
How much cost do you absorb in touchup and replacing missing parts, and how does it compare to the cost of operating a reflow oven that runs whenever you have product available to process? I don't necessarily have an answer for you but I'm having a
Electronics Forum | Thu Oct 23 23:38:48 EDT 2008 | pathakvj
We have 8 layer HASL PCB. We saw molten solder blobs / balls on op side of assembled PCB. (to check, if this was a bare board problem), We passed bare board as received thru, SMT reflow oven and saw solder balls on top side of board. What could be th
Electronics Forum | Mon Nov 17 13:26:05 EST 2008 | evtimov
With the gun you can do removal. Than clean the pads, put some flux, place new BGA(or reballed one) and put it in the reflow oven(if you have one). That's the cheap way you can go without buying an equipment. The other way is to buy machine for BGA
