Electronics Forum | Mon Nov 06 21:02:30 EST 2000 | Dave F
I love this!!! Two whizzettes with the same information and they spin-off in two different directions. Gad this is great!!! Delamination is a pretty broad topic, but that you have a problem with two suppliers makes me think the delamination is cau
Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Mon Oct 16 16:05:59 EDT 2000 | CAL
Brian- IPC has SMEMA Down loads for communication protocal: http://www.ipc.org/html/fsresources.htm. Also, I interfaced a fuji CP6 with a Siemens s20 and had to put in a relay and sensor to complete the communications loop. Fuji uses a 24v on/off com
Electronics Forum | Fri Oct 06 08:48:11 EDT 2000 | CAL
NJEV- You can contact me off line for my opinion on the Easi line :caldon@smtnet.com. Compared to past products this one was weak. Missing parts, Screws sticking out, the thermo-sensor was right next to the button so the longer you held the button th
Electronics Forum | Fri Sep 29 15:33:47 EDT 2000 | Dave F
5 Paste sticking to squeegee: Squeegee is heavily magnetized Some pastes stick more than ... Plastic squeegees stick more than metal Old metal squeegees stick more than new Paste needs to be worked Paste needs to be at room temperature Some fl
Electronics Forum | Tue Sep 26 13:17:55 EDT 2000 | John
We are considering Juki's component verification option on our placement machines as an alternative to incircuit test. Our boards are relatively simple, and the system should catch everything our functional testers will not. We intend to use it to
Electronics Forum | Tue Sep 19 22:15:53 EDT 2000 | Sophia
Hi guys, I have been working in the SMT pick and place process for five years, and now I'm responsible for the solder paste printing process, and one thing that I notice is that the actual process that we have is to poor, actually our main defects a
Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal
guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the
Electronics Forum | Mon Sep 11 20:30:21 EDT 2000 | Dave F
Don�t kid yourself Sal, either: * Components were always falling off your board, but someone just noticed it ... OR * Something in your process HAS changed ... OR * Both Voids are primarily process indicators. I won't comment on the cause of the
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
