Electronics Forum | Thu Feb 04 01:34:51 EST 1999 | Joe Cameron
Hello all, Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? We've checked our solder paste amount, and we've rechecked our reflow profiles and nothing has chan
Electronics Forum | Fri Dec 18 00:49:43 EST 1998 | Mr Mariscal
I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it does
Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Tue Dec 01 14:44:04 EST 1998 | Terry Burnette
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Mon Nov 16 14:24:39 EST 1998 | greg cronin
I loaded my company profile onto SMTNET in the contract manufacturer area, I wanted to load my company logo but there was no way to upload it. I think other people may be having the same problem. Also I tried to go to the update area to fix it but
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Mon Sep 21 09:03:08 EDT 1998 | Greg Curler
| Good Morning, | I am looking for an alternatve to the traditional press in low profile sockets, aka Augat Holetites. I am looking into Mill-Max parts. any suggestions? They are used on the backplanes we build. | Thanks, | Wendy Wendy, We are pr
Electronics Forum | Thu Aug 27 11:17:02 EDT 1998 | Dave F
| hi, | I would like to ask for help if anybody is able to provide any information on the soldering method below. | (1)Hot-Bar Reflow Soldering | (2)Fiber Focussed IF Soldering. | I would really appreciate if you can share with me. | Thanks. | | be
Electronics Forum | Sat Jul 25 04:39:14 EDT 1998 | Stoney Tsai
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Mon Jul 20 17:40:48 EDT 1998 | socheat khun
| Does anyone know why this typically occurs. We have seen capacitors crack due to stressing. Any good solutions? | Regards, | | Steve. Hi steve! Did you check component date-code, reflow profile and component placement height. it has happen to me
