Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
Electronics Forum | Thu Mar 31 20:16:31 EDT 2011 | tkirk
We recently decided to try using a different source for our bare boards to save money. On two different batches of PCBs now from the new source, we are seeing beading including some serious enough to short out underneath 0805 parts. We have never re
Electronics Forum | Fri Apr 01 02:56:18 EDT 2011 | grahamcooper22
the cause could be moisture in your pcbs. To check it...pass some bare pcbs through your reflow oven (this is a simple way of drying them out a bit), then paste and place and reflow as normal....if solder beads disappear then the pcbs have too much m
Electronics Forum | Wed Jun 15 07:47:28 EDT 2011 | edmaya33
Any input on this machine good or bad would be > help ful, thanks This is a Good machine. 5K AOI Perform machine is easy to program and had a built in inline defect viewer. Low false failure/call compare to other platform. Able to detect skew, bri
Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs
We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem
Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Wed Apr 04 08:55:45 EDT 2012 | tombstonesmt
Dave, *The machine looks to keep a steady 290c (I can confirm) *This problem is machine/product specific. We have three other Pillarhouses that run the same alloy/flux but only run this one product at this station. *The solder does have a "tail" whil
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
