Electronics Forum | Fri Apr 27 13:04:35 EDT 2007 | rmitchell
Hi, I am having some problems with my Fuji CP6 placement repeatability. The placement drifts during the build about .06-.10 mm on parts. It has happened on several different builds this week. It is enough to cause some defects after reflow on smal
Electronics Forum | Tue Jun 26 08:42:34 EDT 2007 | grantp
Hi, It's much better to add the cooler after the tank, as the tank will condense a lot of the water before it even hits the cooler and goes out. It's a much better system to have the tank between the compressor and then the cooler. The air also get
Electronics Forum | Fri Aug 24 18:02:51 EDT 2007 | erokc
I'm needing to use DI water for the first time. I called the local Culligan man and was told that distilled water was the same as DI so I bought some. I wanted to determine if it was DI so after reading the postings in the forum I determined the re
Electronics Forum | Tue Aug 28 11:54:25 EDT 2007 | rgduval
Dave, To tell you the truth, I couldn't tell you. I came into this company with the system installed. When the resistivity is depleted, I call Culligan. It may only be an in-line cartridge filter that they change. We've noted a change in water q
Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Thu Sep 13 10:49:24 EDT 2007 | slthomas
If someone knows specifically what the sequence of events is in a Topaz placement step I'd appreciate it if you could share that with me. We've developed an intermittent problem with ours where it places the part and immediately stops with E0873. T
Electronics Forum | Tue Sep 18 19:32:49 EDT 2007 | davef
Welcome Jimmy Let's mince words to help focus on the issues. When you say "QFP area solder paste shifted," do you mean: * Paste printed on land pattern perfectly, but moves after printing. * Paste printed off the land pattern, even though the stenci
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Mon May 12 11:01:43 EDT 2008 | vms
Sr Tech We have worked on mpm since 1995 and when I worked for mpm I thought I knew the machines very well. After being self employed since 1998 we realized that we didn't know hardly any thing. I charge a very small amount for a year of tech suppo
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