Electronics Forum: finish (Page 219 of 229)

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as

Solder paste normalisation period

Electronics Forum | Fri Aug 17 06:40:27 EDT 2001 | nifhail

Thanx Dave/Hussman.. We normally store our solder paste in the refrigerator at 0-10 Deg C as per what the supplier recommanded. Our floor temperature is controlled at 22 +/- 5 Deg C and Humidity is at 55 +/- 5%. Recently we have customer asking fo

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco

Sn/Pb diffusion

Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef

Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over

SMEMA standards

Electronics Forum | Wed Sep 18 18:40:05 EDT 2002 | dougt

Here is how smema works: Machine A has a board to give to machine B. Machine A has an opto or a relay that will turn on or close when it is ready to pass this board to machine B. This is the "board available from previous" signal, telling machine B

FDA Approval

Electronics Forum | Mon Feb 24 20:37:01 EST 2003 | davef

Key Food and Drug Administration [FDA] Compliance Guidelines are in: * Blood/Biotechnology * Cosmetics * Drugs * Food * Medical Devices * Positron Emission Tomography The medical device industry adheres to the rules of Good Manufacturing Practice (G

Safety equipment for servicing solder wave

Electronics Forum | Thu Aug 21 14:23:56 EDT 2003 | kenBliss

In order to service your wave solder machine safely, the following needs to be understood. Ladling dross out of the machine and putting it in into a coffee can or similar is not safe and puts operators and other employees at risk. Protecting the se

Soldermask thickness

Electronics Forum | Fri Oct 03 07:49:18 EDT 2003 | mk

Mask Musings. Soldermask (SM) and its functions have changed and evolved over the years. As an ex-solder mask applicator, I can remember screening Colonial High Gloss Epoxy soldermask on boards back in the early 80's, ending up with a thickness that

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan

Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi


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