Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Mon May 02 18:54:28 EDT 2005 | MikeaJ
The answer you are looking for is part of your initial setup of the board and stencil. This information is to be found in the PCB setup menu/icon. The reason why the stencil loading pins are impacting the frame is because the default setting of the s
Electronics Forum | Wed May 04 17:15:02 EDT 2005 | siverts
Hey Dr . Klein, I think You do it all right... But here it comes: MSD; what does it really means? MS-level; what does it really means? Floor life what does it really means? I'm sorry but I can't answer all these questions right now. It is a complex m
Electronics Forum | Fri May 27 14:15:21 EDT 2005 | ve7khz
Hi Folks, Starting a second SMT line this year and it's been (too) long since I have looked at newish machines and I am in need of some assistance with P&P machine selection. Here is what we currently have: Panasonic CM-202 chip shooter 216 8mm reel
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef
Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Sat May 27 02:52:20 EDT 2006 | TimS
Gentlemen I have managed to pull myself together after banging my head. I am not sure the flux volume is the total solution here. All spray processes deposit flux in a similar manner, that is to say the vast majority of material sprayed onto the PCB
Electronics Forum | Fri Oct 27 08:07:03 EDT 2006 | JH
Yes, that is the unit I have tried (or as you say, a convincing copy). Sorry aj, some months ago on this thread you asked where I was based and the answer is Nottingham, England. I only check this site once every few months and it has been a busy
Electronics Forum | Wed May 31 10:39:33 EDT 2006 | grantp
Hi, We actually tried to get major parts of our line from the same supplier, however each supplier is good at some parts of the line, and not others. We went with Soltec oven and wave, which work well, and have not had any issues, plus DEK printer
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