Electronics Forum | Sun Apr 29 15:43:38 EDT 2001 | davef
Call me wet behind the ears!!! I'd kinda like to see you refine your processes on your products before you go-out drying-out your ears on someone else's products. The worst contractors in the world seem to be those with their own product lines and
Electronics Forum | Mon Nov 27 09:09:24 EST 2000 | Bob Abell
Taking any number of people off the line would be expected to slow production. That is one major advantage for more individualized approaches. Intermec in Washington faced this problem, with a need to train ESD prevention but a strong push-back fro
Electronics Forum | Tue May 15 15:15:53 EDT 2001 | ohboy
Hi all, I just discovered this forum and I'm very impressed. We have a vendor who recently stopped placing desiccants in the vacuum packaging for our pcbs. (Yes, it's on the dwg!) His reasoning was that the desiccants can degrade the finish on the
Electronics Forum | Wed May 16 13:55:25 EDT 2001 | davef
Urethane and parylene have the best long term humidity resistance of the conformal coatings. Since yer not hep about urethane, try the parylene [http://www.paratronix.com/apps/, http://www.paryleneinc.com/, http://www.parylene.com/, http://www.scsco
Electronics Forum | Tue May 29 05:22:50 EDT 2001 | wbu
Why not find a rock to climb on instead of under ? You may find that it needs TRUST in your safety equipment ( harness, rope, slings, partner .... ) and concentration on your part to succeed that task. I haven�t checked those proposed parameters bu
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Wed Jun 13 18:04:00 EDT 2001 | traviss
It is possible with a few universal profiles. I did this with 3 temperature ranges and 3 speeds for each, 9 profiles total. With this setup I could run any of about 150 boards most of them in the middle 3 profiles. My goal was to reduce change over i
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Wed Jun 27 21:33:09 EDT 2001 | davef
There was a similar thread last week on SMTnet. Maybe the poster of that thread can help. Not everyone responds on-line. Check the SMTnet Archives for generalities and platitudes about PIH, although there may be some good links. Baring the obviou
Electronics Forum | Mon Jul 16 21:44:07 EDT 2001 | davef
You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PRO
