Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax
I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top
Electronics Forum | Fri Aug 03 15:58:07 EDT 2001 | arsmoriendi
Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after i
Electronics Forum | Tue Jul 31 20:38:49 EDT 2001 | jbull
Does any have any experience with Multitroniks pick & place machines. How do the machines perform for accuracy, repeatability, programmability and serviceability? Does the machine have a good uptime record? How is the service & support? I ask these q
Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F
JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa
Electronics Forum | Thu Feb 03 08:20:49 EST 2000 | JAX
Once you have the capabilities to track a board from the initial stages in kitting all the way out the door in box build the possibilities are endless. You will now have: 1. An exact count of your companies WIP. 2. The exact location of every board i
Electronics Forum | Sat Jan 29 13:06:18 EST 2000 | Graham Naisbitt
Todd, All liquid coatings are Newtonian - they follow gravity so they do indeed run away from sharp leads and edges. Silicones are generally worse because they have very low surface energy - although this is an asset when trying to get under compone
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F
Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
Electronics Forum | Mon Jan 03 11:00:25 EST 2000 | Brian W.
At my last company, we installed in-line testers. They worked very well, but there were some issues to be addressed; 1 - Boards had to be cool enough to go through ICT or we had false failures. 2 - We used no-clean flux...enough said about that. 3
