Electronics Forum: casing (Page 224 of 246)

MOLE's Oven rider

Electronics Forum | Mon Jan 04 22:59:23 EST 1999 | Kris Ewen

I'd like to add something about the ECD product. During a past work term (I'm a a co-op student) in an SMA plant, I worked extensively with the Super MOLE Gold in developing the reflow profiles for high-mix, low-volume production. I was 'married' t

How to Read Circuit Diagrams for Beginners

Electronics Forum | Mon Nov 30 09:33:51 EST 2020 | chucherry5076

This articles shows how to read circuit diagrams for beginners in electronics. Learn to read electrical and electronic circuit diagrams or schematics. A drawing of an electrical or electronic circuit is known as a circuit diagram, but can also be cal

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Re: Wetting Balance Equipment

Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis

| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F

Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce

Re: Tape residue cleaner

Electronics Forum | Fri Apr 07 17:17:55 EDT 2000 | Dave F

Ashok: You should select and use low residue tapes. But ya know, ya go out and research a great tape and if yer not careful, the buyer will second source ya and (surprise) ya got residues again. We have found that Lemme say this about Katon tape

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us


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