Electronics Forum: plating (Page 226 of 260)

Re: Micro balls on gold fingers

Electronics Forum | Mon May 18 21:29:38 EDT 1998 | D.Lange

| I've tried every thing I can think of. Do you have any | Ideas? | What I have is micro balls on the gold fingers of | panelize boards. These balls only appear on the gold | finger. Or at least I can only find them on the gold | fingers. | What I

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson

| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are

Re: Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Finishing myth ?

Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon

| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Wed Mar 25 19:31:13 EST 1998 | Earl Moon

| | We are having some problems with "drawbridging" on 0805 film capacitors. | | We have already reduced the pad width from .050" to .040" based on input | | from vendor. Defects appear to be random as far as location on the PWB and direction | | o

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Sun Mar 29 15:42:05 EST 1998 | Michael Fogel

| | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | We have already reduced the pad width from .050" to .040" based on input | | | from vendor. Defects appear to be random as far as location on the PWB and direction

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon

| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman

| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 12:55:15 EST 1998 | N.J Bateman

| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would


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