Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef
Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas
Electronics Forum | Wed Nov 13 21:16:28 EST 2002 | Vinny
Hi All, I am producing a lot of high cost PCBA where the pCB material is the `ROGER' material. Due to some of the high components and handling we get pad lifted issues sometimes and as of now are unable to do repairs on these. Please help if anybo
Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf
We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing
Electronics Forum | Wed Aug 27 00:01:28 EDT 2003 | Mike Konrad
Danger Will Robinson� Danger! Never mix a post-reflow cleaning system with a raw paste removal application (particularly on an inline cleaning system)!. The paste that comes off a screen contains solder balls that are so small, they will eventuall
Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Mon Dec 22 19:53:11 EST 2003 | Dean
Digital camera's are worth their weight in gold! Foremost it's a health and safety issue. That alone should compel the management team to get with the program. As an Engineer I have to know how to operate, program, maintain, troubleshoot and CLEAN
Electronics Forum | Thu Jan 22 15:37:04 EST 2004 | solderboffin
Hi Vijay The short answer is, there isnt one! Sorry to be vaugue but its pretty much up to you and the quality systems you are working to. The generally accepted interval is every month, but there are not rules. The other issue to face is the defini
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Wed Jun 16 13:25:09 EDT 2004 | russ
have you tried a more agressive flux like water soluble to see if the problem goes away? Or can they be hand soldered with no problem? I am basically out of ideas other than a bad nickel or tin finish. The reflow profile didn't seem out of whack f
Electronics Forum | Wed Jul 07 11:49:34 EDT 2004 | Svensen
Curiously... Shelf-life of the plating alternatives has been mentioned several times as a potential issue in these discussions. Tell me is there a market for a simple plastic packaging which could extend shelf life (and hence solderability) of these
