Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me
Electronics Forum | Tue Feb 06 06:41:53 EST 2007 | pavel_murtishev
Good afternoon, You have to use lead paste since none-RoHS components won�t withstand elevated temperatures. Solder paste manufacturers offer a lot of transitional pastes designed specially for mixed process. Ask your paste supplier for transitional
Electronics Forum | Tue Mar 20 15:59:15 EDT 2007 | blnorman
We use preprinted labels and laser coding. For PCB we laser mark with CO2 (NdYAG for the aluminum heat spreaders). We either have an epoxy legend to burn out or we burn the solder mask to expose the copper ground plane underneath. Laser is a much
Electronics Forum | Thu May 01 14:25:31 EDT 2008 | ck_the_flip
Most white papers, like this one http://members.ipc.org/ipclogin/ipcmembers/IPC/Route/0706/0706techpaper.pdf, have written that lead contamination in a lead-free solder joint leads to all sorts of reliability problems. Consensus is that, if the cont
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000
Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo
Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura
I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Tue Aug 14 02:28:02 EDT 2018 | colinbenton
I finished a new design recently and need the boards fabricated and soldered. The question is the manufacturer needs me to provide pick and place files for the assembly , can any ones help and advise how I can generate P&P file ? I use Eagle for PCB
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
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