Electronics Forum | Tue Dec 11 17:04:33 EST 2007 | pgarsoe
We want to start a discussion on the solar manufacturing market in response to a conversation with Anita Brown of Indium at the recent Productronica show in Germany. Since we referred to it in our show report newsletter we decided to start a thread a
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Wed Jan 23 11:28:47 EST 2008 | tbkonrad
Help! Since last Friday i have been having issues with a Quad qsv-1, it all started with a quad align error, i found there to be a small quantity of grease covering the lenses on both quad align sensors. I wiped the grease off and then everything s
Electronics Forum | Tue Jan 29 23:17:43 EST 2008 | operator
Dude... That is harsh. I quit the best paying job I had ,at that time, because the owners disrepected me over my deserved salary. I was the sole programmer at this little shop that for some reason lasted for years after I was gone, but anyway....Othe
Electronics Forum | Thu Feb 28 08:58:02 EST 2008 | adlsmt
We actually ran production boards on Mydata and Universal Advantis. The Mydata machines software was very command line oriented which I thought was strange but they said they had no intention of upgrading it. The Mydata placement accuracy was superb.
Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp
The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own
Electronics Forum | Fri Feb 29 08:12:56 EST 2008 | davef
Solder paste suppliers often make recommendations on solder paste handling after removing it from the container [eg, jar, cartridge, etc]. For instance, Multicore Solder Paste Handling Guidelines, September 2004 says: As a general rule, paste that h
Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Thu Jun 05 20:20:30 EDT 2008 | mika
Of course this should never occur, but this, forgive me shitty worlds of a complex Flexa system, which makes me cry once in a while. Does anybody here at this forum know what it takes to install this shit? First You have to set up a dedicated Flexa
