Electronics Forum: use (Page 2289 of 2488)

Please Help: Pace TF 1800 or Finetech CorePlus

Electronics Forum | Thu Apr 25 05:56:32 EDT 2019 | pdrirrework

Hello, Have you had a look into our Focused IR Rework systems? A popular alternative to the convectional Rework systems. Our IR-E3M (Micro) would be perfect for your applciation and on one machine you will have the capability of Reworking BGAs up to

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: Sn/Ag Terminations with Sn/Pb Solder

Electronics Forum | Sat Jan 06 10:27:07 EST 2001 | Dave F

This is a very timely topic, as we drift [buffeted by the combined wind of everyone down-stream in the supply chain ] on waves carrying all of us from the land of lead to the land of no-lead. I want to say there was a recent trade journal article pu

Re: Castellated Solder Pads

Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F

Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast

Re: Tin-oxide deposits

Electronics Forum | Mon Oct 16 20:29:32 EDT 2000 | Dave F

Jason: How did you determine that the deposits are tin oxide? What does this stuff look like? Klein Wassink "Soldering in Electronics" (p. 221, quoting original work by others). States (in effect) tin (or solder) quickly forms a protective oxide

Re: BS

Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX

MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha

Re: APerture size for microBGA

Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX

sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st

Re: Black hole process (MacDermitt) for PCB fab

Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F

Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the

Re: Tape residue cleaner

Electronics Forum | Fri Apr 07 17:17:55 EDT 2000 | Dave F

Ashok: You should select and use low residue tapes. But ya know, ya go out and research a great tape and if yer not careful, the buyer will second source ya and (surprise) ya got residues again. We have found that Lemme say this about Katon tape


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