Electronics Forum: reflow profile (Page 230 of 259)

Re: Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Wed Jul 14 13:22:51 EDT 1999 | kt

| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it

Re: Process Change

Electronics Forum | Sun Jun 06 08:00:06 EDT 1999 | Dave F

snip | Ryan, | | The only advive I got is just don't do it!. Dave's right the grain growth in it is pretty bad. the other thing you got to look at is how much heat is the board gonna produce in it's working life..??? and where is it gonna be used,

Nitro in the Reflow

Electronics Forum | Thu Apr 29 17:19:59 EDT 1999 | Kevin Hussey

Hi Boys and Girls, I've been given the "task" to turn off the nitrogen in our reflow ovens. I am using the BTU, TRS series ovens, each with eight zones. Also, I have a couple of new BT Paragon ovens with 10 zones. We currently are running Qualite

Re: white dirty solder

Electronics Forum | Mon Jan 19 20:25:52 EST 1998 | Steve Gregory

| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct

Data-PAQ's Rapid Oven Set-Up (ROS)

Electronics Forum | Wed May 22 05:10:45 EDT 2002 | johnw

Ron, The new ystem is probably the best one I've seen for useability, the who thing can be driven by wizards to guide people through what they need to do. The system has the ability to set alarm's that will basically analyse your result's for you an

Heller Oven blowing parts off reflowing

Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc

Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone

Conformal coating IS-410 boards

Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller

Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap

Re: Solder Resist Solder balls - 'N Surface Energy

Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon

| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Solder balls on Cleaned process

Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie

We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi


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