Electronics Forum: solderability issue (Page 230 of 307)

SMT before through-hole

Electronics Forum | Tue Aug 14 16:26:21 EDT 2007 | slthomas

So it's a C-n-C clearance issue? Could you go with the other cutnclinch unit...which ever you have, get the other one (one's right angled, one's offset at 45�)? Yeah, I know, they're not cheap. Other than that, hand place some of the SMT in chip bon

Thermal screening for marginal BGA joints

Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau

Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe

wave soldering + header connector assembling problem

Electronics Forum | Thu Nov 08 08:44:22 EST 2007 | aj

Hi, I have just taken a look at the Connector Images. Is there a difference in pitch between both connectors ? From the photo it looks like the Annular Rings are oversized on Image #1 especially around the centre area ( this might be the image ).

Best Alpha Lead Free WS paste??

Electronics Forum | Thu Jan 10 11:37:43 EST 2008 | jdengler

Hi JD, We use the OM-310 NC for most of our lead free work and see some wetting issues. We also have a lead free produst that requires cleaning so we use the WS-819. It does seem to wet better although I have never tried the WS-819 on the same b

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 15:51:26 EST 2008 | jax

We have place CSP devices with 0.105mm standoff hights without any issue. The ability to Water Wash all depends on the specifications of your wash... Spray pressure and qty of jets Dwell time, pre-wash/wash/rinse Available detergents or saponifiers

BGA dropping off the board

Electronics Forum | Thu Feb 14 07:34:10 EST 2008 | jdumont

How many fell off out of your entire lot? What was the soldering quality like on the ones that didn't fall off (xray, visual)? You need to determine if its a random problem or if even the ones that stayed on are barely on and go from there. If the o

Solder Paste Dry out

Electronics Forum | Wed Mar 05 17:03:36 EST 2008 | ratsalad

We had the misfortune of ending up with a batch of Kester EM907 that would start to "set up" well before it's shelf life was over. Since the lead time for a new batch was excessive, a Kester technical guru came to our facility to help us deal with t

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Is there a cross section standard test method...

Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta

hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /

Tombstoning issues!!!

Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip

Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer


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